EVG 520 Wafer Bonder

EVG 520 Wafer Bonder consisting of:

- Model: EVG 520
- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Auto opening of bond tool cover
- Windows based control software and operation interface
- Wafer size: up to 200mm capable
- Vacuum chuck: 8"/200mm diameter chuck
- Max Bond Force: 3.5kN
- Mini-environment frame
- Pfeiffer TMH-071P Turbo Pump
- Pfeiffer Vacuum Controller
- Load/unload tool
- System computer, monitor, and keyboard
- Windows XP Operating System
- Serial Number: S030122
- Vintage: 2003
- Operations Manual for EVG 520 Bonder.
- Used minimally at startup and in like-new condition!

2003

Excellent Condition Guaranteed.
Fully Reconditioned to Factory Specifications by ClassOne.
3 Month Warranty and Full Specification Guarantee.
30 Day Right of Return.

2-4 weeks