EVG 520 Wafer Bonder
Model:
EVG 520 Wafer Bonder for sale
Price:
Request Price Quote ID#: 3383
Picture:
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Details:
EVG 520 WAFER BONDER consisting of:
- Model: EVG 520
- Setup for bonding 8"/200mm wafers
- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Anodic bonding can be added at additional cost (inquire for pricing)
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Auto opening of bond tool cover
- Windows based control software and operation interface
- Vacuum chuck: 8"/200mm diameter chuck
- Max Bond Force: 7 kN
- Bottom side heater: 550
Vintage:
2002 (Refurbished in 2008 by EVG)
Condition:
Excellent Condition Guaranteed.
Fully Reconditioned to Factory Specifications by ClassOne.
3 Month Warranty and Full Specification Guarantee.
30 Day Right of Return.
Delivery:
4-6 weeks
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