EVG 520 Wafer Bonder

EVG 520 WAFER BONDER consisting of:

- Model: EVG 520
- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Anodic bonding can be added at additional cost (inquire for pricing)
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Auto opening of bond tool cover
- Windows based control software and operation interface
- Wafer size: up to 200mm capable
- Vacuum chuck: 8"/200mm diameter chuck
- Max Bond Force: 7 kN
- Bottom side heater: 550°C max. in 1°C steps
- Temperature uniformity: ± 1,5 %
- Turbo pump and controller
- Roughing pump
- Load/unload tool
- System computer, monitor, and keyboard
- Windows XP Operating System
- Serial Number: S020056
- Vintage: 2002 (refurbished by EVG in 2008)
- Operations Manual for EVG 520 Bonder.
- Available for full inspection and demonstration
- Installation, training, service, and support available worldwide

2002 (Refurbished in 2008 by EVG)

Excellent Condition Guaranteed.
Fully Reconditioned to Factory Specifications by ClassOne.
3 Month Warranty and Full Specification Guarantee.
30 Day Right of Return.

4-6 weeks