EVG 520IS Wafer Bonder

EVG 520IS WAFER BONDER consisting of:

- Model: EVG 520IS
- Manual Wafer Bonder
- Wafer sizes up to 6"/150mm
- Wafer size up to 8"/200mm if upgraded (inquire for cost)
- Silicon Direct and Thermo Compression Bonding capable
- Independent Temperature Control for Top and Bottom Wafer
- Multi-Stack Bonding for all Bond Processes
- 6" diameter High Temperature Vacuum Chuck
- Max Bond Force: 60kN
- Max Temperature: 600 degrees C
- Turbo Pump
- Pump Controller
- Top and Bottom Heaters
- Computer, Keyboard, Monitor and Mouse
- Vacuum Pump (roughing pump)
- Load/Unload Tool
- Emergency Off Button (EMO)
- Operator Manuals
- Vintage 2008

*Note: System has upgraded/enhanced heat and pressure capabilities

2008

Excellent Condition Guaranteed.
Fully Reconditioned to Factory Specifications by ClassOne.
3 Month Warranty and Full Specification Guarantee.
30 Day Right of Return.

4-6 weeks