Suss SB8e Wafer Bonder
SUSS SB8e WAFER BONDER consisting of:
- Model: SB8e
- Manufacturer: Suss MicroTec / Karl Suss
- Manual Wafer Load Wafer Bonder
- Wafer and substrate size: up to 8"/200mm
- Windows 2000 Operating Software
- Suss Software Version: 1.4.0.33
- Vacuum down to 5x10e-5 mbar.
- Max Bond Force: 20 kN
- Overpressure control with 3 bar max
- Pos/neg 2000V/15ma power supplies
- Bonding in controlled environment
- Flexible process control using a Windows operating environment with data recording and analysis
- Anodic, Silicon Fusion, Adhesive, and Thermal Compression Bonding!
- Chuck: 8"/200mm Bond Chuck (or sizes available)
- Temperature Control to 500 degrees C
- Edwards xDS10c Vacuum Pump
- Pfeiffer THM 262 Turbo Pump
- Brand New LCD Monitor
- Operating Manual for Suss SB8e
- Manufactured in 2008!
- This system is in like-new condition!
- Used minimally at start-up company!
- Refurbished to meet original Suss SB8e specifications by former factory trained Suss technicians
2008
Excellent Condition Guaranteed.
Fully Refurbished to Factory Specifications by ClassOne.
6 Month Warranty and Full Specifications Guarantee.
30 Day Right of Return.
Available for Full Inspection and Demo at our Facility.
We offer Installation & Training of our Refurbished Karl Suss Substrate Bonders.
6-8 weeks
