TOHO FLX-2320 Film Stress Measurement System
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TOHO FLX-2320-S FILM STRESS MEASUREMENT SYSTEM consisting of:
- Model: FLX-2320-S
- Manual Wafer Load
- Thin Film Stress Measurement System
- Chuck Size: up to 8"/200mm
- Temperature: up to 500C
- Dual Wavelength Technology
- Microsoft Windows based software
- WINFLEX Version 6.0 Software
- System Computer: Pentium III, 700Mhz, 256MB,
- Operating System: Windows XP Professional
- Brand New LCD Monitor
- Wafer Locator Included (1 set, select size at time of order)
- Gas Inlet for Inert Gas Atmosphere Stress Measurement
- Vintage 2006
- S/N0 906-8061
- System Power: 230V, 50/60Hz, 1PH, 15A
- Operations Manual and Documentation
- Refurbished to Meet OEM Specifications
TOHO FLX-2320-S System Capabilities consisting of:
- Thin-film stress measurement instrument that measures the changes in the radius of curvature of a wafer caused by the deposition of a stressed thin film.
- Laser scanning to measure stress on all reflecting films.
- Measures and displays stress as a function of time or temperature.
- Comprehensive data analysis capabilities that include trend plotting for statistical process control (SPC) and displaying a 3-D map of wafer deflection over the entire surface.
- Used for calculation of biaxial modulus of elasticity and linear expansion, water diffusion coefficient in dielectric films, linear regression and stress-temp or stress-time gradients.
- Provides analysis of thin film stress with very low measurement noise and allows observation and quantitative evaluation of stress relaxation, oxide densification, thin film phase transformations and annealing.
2006
Excellent Condition Guaranteed.
Fully Reconditioned to Factory Specifications by ClassOne.
6 Month Warranty and Full Specifications Guarantee.
30 Day Right of Return.
6-8 weeks
