Toray OF2500 Flip-Chip Bonder

TORAY OF2500 FLIP CHIP BONDER consisting of:

- Model: OF2500-07
- Super High Accuracy Flip Chip Bonder (for optical devices)
- Toray OF2000 Series Flip Chip Bonder
- Head has a Bond Force Range of 0 - 10 N (low pressure) and can heat up to 500C in a few seconds
- Substrate Heater (lower heater) has a Temperature Range of 0 - 400C
- Micron Accuracy: +/- 0.5 (x and y axis)
- Theta Accuracy: 0.3 deg
- Substrate Heated Stage: 0-400C
- At Head Attachment: 0-500C (for die/chip)
- 5"/4"/3" Wafers including small pieces (substrate size)
- Chip/Die size depends on Attachment Tool (1mm x 2mm die were previously used. Have heard of as small as 200um x 200um and as large as 15mm x 15mm, with 10mm x 10mm bonding pad area.)
- Bonding Force: 0-10 N
- Auto Alignment / Mark Detection for Automatic Bonding
- IR inspection
- Auto parallel function
- Active anti-vibration
- N2 purge stage
- Data logger, Ionizer, Vacuum pump, Auto Tool Changer
- Operations Manuals for Toray OF2000/OF2500 Bonder
- Recently serviced and PM'd by Toray factory technician
- Available for full inspection and demonstration
- More information: http://www.toray-eng.com/semicon/bonder/flip-lineup/of2000.html

2000

This System is being Sold in AS IS Condition Only.

Recently Serviced and PM'd by Toray Factory Technician.
Available for Full Inspection and Demonstration.

Currently Installed in FAB.

2-4 weeks