Surface Metrology

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Metrology Equipment

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Manufacturer

Model

Configuration

Max Wafer

5100 Overlay Registration System

KLA-Tencor 5100 Overlay Registration System

8"/200mm Wafer Capable, Fully Automated Non-Contact Box-In-Box Measurement

Stress Measurement System, 200mm Chuck, up to 500C, Data Analysis Capability

HRP-220 Profiler

Automated Surface Profilometer, Calibrated to OEM Specifications, Up to 8"/200mm Wafer Capable, Automated Handler

P-22 (P22) Profiler

Automated Surface Profilometer, Calibrated to OEM Specifications, 8"/200mm Wafers, Automated Handler

Prometrix RS100

Four Point Probe, Up to 8"/200mm Wafers, 3-D Plots, Contour Mapping, Temperature Compensation

Four Point Probe, 200mm, Manual Wafer Handling, Contour Mapping, 3-D Plots

Prometrix RS55/tc

Four Point Probe, 200mm, Temp Compensation, Manual Wafer Handling, Contour Mapping, 3-D Plots

Prometrix RS55/tc

Four Point Probe, 200mm, Temp Compensation, Manual Wafer Handling, Contour Mapping, 3-D Plots

Prometrix RS55/tc

Four Point Probe, Temp Compensation, 200mm, Manual Wafer Handling, Contour Mapping, 3-D Plots

Prometrix RS55/tca

Four Point Probe, Temp Compensation, 200mm, Manual Wafer Handling, Contour Mapping, 3-D Plots, Diameter Scans

200mm/300mm, Puck/Vacuum, Single Open Handler