Surface Metrology

Metrology Equipment

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Surface Metrology

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Manufacturer

Model

Configuration

Max Wafer

Overlay Registration System

Overlay Metrology System, Setup for 8"/200mm Wafers, Fully Robotic

ADE

ACS 2000 Controller, 4" to 8" Wafer Capable, Measures Wafer Thickness, Shape and Flatness

8"/200mm Wafer Capable, Fully Automated Non-Contact Box-In-Box Measurement

8"/200mm Wafer Capable, Fully Automated Non-Contact Box-In-Box Measurement

8"/200mm Wafer Capable, Fully Automated Non-Contact Box-In-Box Measurement

200mm Wafers, Stress Measurement System, Fully Automated, Open Cassette Station

Stress Measurement System, 200mm Chuck, up to 500C, Data Analysis Capability

HRP-200 Profiler

Automated Surface Profilometer, Calibrated to OEM Specifications, Up to 8"/200mm Wafer Capable, Automated Handler

HRP-220 Profiler

Automated Surface Profilometer, Calibrated to OEM Specifications, Up to 8"/200mm Wafer Capable, Automated Handler

Automated Surface Profilometer, Calibrated to OEM Specifications, 8"/200mm Wafers, Automated Handler

Automated Surface Profilometer, Calibrated to OEM Specifications, 8"/200mm Wafers, Automated Handler

Prometrix RS100

Four Point Probe, 200-300mm, Fully Automated

Prometrix RS55/tc

Four Point Probe, Temp Compensation, 200mm, Manual Wafer Handling, Contour Mapping, 3-D Plots

Prometrix RS55/tca

Four Point Probe, Temp Compensation, 200mm, Manual Wafer Handling, Contour Mapping, 3-D Plots, Diameter Scans

MTS

Nano Indenter SA2

Characterizes Material Surfaces down to the level of a few Nanometers

Dektak 3 Profiler

Up to 5" Wafer Capable, Measures Step Height, Surface Roughness, Waviness and Curvature

Dimension 3000 AFM

150mm Chuck, Nanoscope IIIa Controller

NT3300 Optical Profiler

Non-Contact Optical Profiler, Automatic Stage, 8"/200mm Wafers