Surface Metrology

Metrology Equipment

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Surface Metrology

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Manufacturer

Model

Configuration

Max Wafer

Overlay Registration System

Overlay Metrology System, Setup for 8"/200mm Wafers, Fully Robotic

ADE

ACS 2000 Controller, 4" to 8" Wafer Capable, Measures Wafer Thickness, Shape and Flatness

8"/200mm Wafer Capable, Fully Automated Non-Contact Box-In-Box Measurement

8"/200mm Wafer Capable, Fully Automated Non-Contact Box-In-Box Measurement

200mm Wafers, Stress Measurement System, Fully Automated, Open Cassette Station

Stress Measurement System, 150mm Chuck, up to 500C, Data Analysis Capability

Stress Measurement System, 200mm Chuck, up to 500C, Data Analysis Capability

HRP-200 Profiler

Automated Surface Profilometer, Calibrated to OEM Specifications, Up to 8"/200mm Wafer Capable, Automated Handler

HRP-220 Profiler

Automated Surface Profilometer, Calibrated to OEM Specifications, Up to 8"/200mm Wafer Capable, Automated Handler

Automated Surface Profilometer, Calibrated to OEM Specifications, 8"/200mm Wafers, Automated Handler

Prometrix RS100

Four Point Probe, 200-300mm, Fully Automated

Prometrix RS55/tc

Four Point Probe, Temp Compensation, 200mm, Manual Wafer Handling, Contour Mapping, 3-D Plots

Prometrix RS55/tca

Four Point Probe, Temp Compensation, 200mm, Manual Wafer Handling, Contour Mapping, 3-D Plots, Diameter Scans

Prometrix RS55/tca

Four Point Probe, Temp Compensation, 200mm, Manual Wafer Handling, Contour Mapping, 3-D Plots, Diameter Scans

MTS

Nano Indenter SA2

Characterizes Material Surfaces down to the level of a few Nanometers

Dektak 3 Profiler

Up to 5" Wafer Capable, Measures Step Height, Surface Roughness, Waviness and Curvature

Dimension 3000 AFM

150mm Chuck, Nanoscope IIIa Controller

NT3300 Optical Profiler

Non-Contact Optical Profiler, Automatic Stage, 8"/200mm Wafers