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Etching Systems
Browse our complete inventory below or
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to learn why you should choose ClassOne for high quality Etching Systems equipment.
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Manufacturer
Model
Configuration
Oxford
Plasmalab 80 Plus RIE
Non-load locked RIE, 240mm electrode, Windows XP, 2005 vintage, like-new condition!
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Oxford
Plasmalab 80 Plus RIE
Setup for Dielectris, Polymer Etching, 600W RF Generator, new computer, latest software installed!
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Plasmatherm
790 Dual Chamber PECVD
2 PECVD chambers, Twin 240mm Plates
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Plasmatherm
790 PECVD System
PECVD Chamber, up to 150mm wafer capable, Non-Load Locked Chamber
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Plasmatherm
SLR-720 RIE
8"/200mm wafers max, single load-locked chamber, 11" Electrode, Chlorine Chemistry
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STS
Multiplex ICP ASE Etcher
Deep Silicon Etch, Bosch Process, Electrostatic Wafer Clamp Electrode, He Backside Cooling,
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STS
Pegasus ASE VPX Etcher
150mm or 200mm capable, Deep Silicon Etching, 25um/min Etching Rate
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Tepla
600 Plasma Asher
150mm wafer capable, 245mm diameter chamber, 600W RF power generator
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Yield Engineering
YES-R3 Plasma Asher
Down Stream Plasma Asher, 12"x12" Sample Shelves (2)
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