Other Process

Process Equipment

Other Process

Other Process

Image

Manufacturer

Model

Configuration

2400 MOCVD Reactor System

4"/100mm, 9 MO Source Positions

ATMI

Delatech 859 CDO Gas Burner

ATMI Delatech 859 CDO Gas Burner with H2O Recirculation

ATMI

Delatech 859 CDO Gas Burner with H2O Recirculation

ATMI Delatech 859 CDO Gas Burner with H2O Recirculation

Fusion 200 PCU Photostabilizer

8"/200mm Wafers, Software Version 3.271, Thermal Chuck

Fusion 200 PCU POLO Photostabilizer System

8"/200mm wafers, UV Bake process application

250 deg C. Max Temp, 10 1/2 x 14 x 13 1/2" Inside Dimensions

Cascade TEK

TBO-1 Forced Air Oven

Forced Air Oven, 300 Deg C Max, Watlow 981 Controller

Cascade TEK

TBO-1 Forced Air Oven

Forced Air Oven, 300 Deg C Max, Watlow 981 Controller

Cascade TEK

TBO-1 Forced Air Oven

Forced Air Oven, 300 Deg C Max, Watlow 981 Controller

Dryden Eng.

2035C1 Stainless Steel Isolation Table

Stainless Steel Construction, Dimensions: 35 3/4" x 47 3/4" x 35 7/8"

E-8025 Wafer Transfer System

150mm wafer transfer system, single station

E-8025 Wafer Transfer System

150mm wafer transfer system, single station

Various Fire Cabinets

Chemical / Fume / Fire Cabinets

Kinetic Systems

Vibraplane 1200 Series Isolation Table - 47" x 30"

Kinetic Systems Vibraplane Isolation Table, Air Suspension, 47" x 30" x 30"

Kinetic Systems

Vibraplane Isolation Table

Vibration Isolation Table, Air Suspension

Accupol 12 Lapping & Polishing Jig

Series A, Mitutoyo Digital Micrometer, 3" vacuum chuck, adjustable spring tension

6-inch Polishing Jig

6" Vacuum Base, Dial Gauge

LP50 Lapping & Polishing System

Eccentric sweep on 3 workstations, 1 autofeed cylinder, 1 polishing plate included

LP50 Lapping & Polishing System

Eccentric sweep on 3 workstations, 1 autofeed cylinder, 1 polishing plate included

PM5 Lapping & Polishing System

Logitech PM5 Lapping & Polishing System

PM5 Lapping & Polishing System

Logitech PM5 Lapping & Polishing System

PP6 Polishing Jig

4" wafers, single dial gauge

Eureka III Jr. UKA-625 Wafer Transfer System

Mactronix Wafer Transfer System

Moticam 1000 Digital Camera

High Resolution (1.3 Mega pixels) Live Imaging Camera (P5370)

Moticam 2000 Digital Camera

High Resolution (2.0 Mega pixels) Live Imaging Camera

Moticam 2300 Digital Camera

High Resolution (3.0 Mega pixels) Live Imaging Camera (P5340)

Moticam 2500 Digital Camera

High Resolution (5.0 Mega pixels) Live Imaging Camera (P5565)

Moticam 3000 Camera

High Resolution (3.3 Mega pixels) Live Imaging Camera (M1054)

Moticam 3000C Camera

High Resolution (3.3 Mega pixels) Live Imaging Camera with Peltier Cooling Device.

Moticam 5000 Digital Camera

High Resolution (5.0 Mega pixels) Live Imaging Camera (M1056)

Moticam 5000C Digital Camera

High Resolution (5.0 Mega pixels) Live Imaging Camera with Peltier Cooling Device (M1057)

ProTemp SolaReactor PRO-200 4-Stack, Multi-Process Furnace

TOC-VCPN E100V Analyzer System

Shimadzu TOC-VCPN E100V Analyzer System

DI Water System

Siemens DI Water System

Thomas Swan

CCS-MOCVD 6x2 Reactor

CCS-MOCVD 6x2 Reactor

TMC

Vibration Isolation Table

47" X 30" x 31" H

OF2500 Flip-Chip Bonder

+/- 0.5 (x and y axis) accuracy, bond force 0 - 10 N (low pressure), temperature 0-400C

Yield Engineering

YES LP3 HMDS Vapor Prime Oven

HMDS Vacuum Bake, Vapor Prime Oven, Vacuum Pump included

Yield Engineering

YES-6112 HMDS Oven

200mm wafer capable, HMDS vapor prime, vacuum bake oven

Yield Engineering

YES-PBSFP Polyimide Bake Oven

Polyimide Bake Oven with Vacuum Pump