New Arrivals

New Arrivals

New Arrivals

New Arrivals

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Manufacturer

Model

Configuration

2400 MOCVD Reactor System

4"/100mm, 9 MO Source Positions

8ft Polypro Wet Bench

3 Heated Teflon Baths, 1 Static Teflon Bath, All baths sized for single 6" cassette, like-new!

8ft Polypro Wet Bench

2 Heated Teflon Baths, 2 Static Teflon Bath, All baths sized for single 6" cassette, like-new!

4055-2 Plasma Asher

Branson 4055-2 Plasma Asher.

PM-21020 Plasma Asher

Branson PM-21020 Plasma Asher.

6ft Stainless Steel Wet Bench

Stainless Steel Wet Bench

7ft Polypro Wet Bench

Simple wet bench for R&D with lots of open deckspace

DAD- 2H/6T Dicing Saw

6"/150mm Capable, Manual Wafer Load, Ideal for R&D Applications

DFD-6362 Dicing Saw

8"/200mm & 12"/300mm Wafer capable, Dual Facing Spindle, Fully Automated Dicing Saw

EVG

520 Wafer Bonder

Fusion & Thermal Compression Bonder, Up to 8"/200mm Wafer Capable, 7 kN Max Bond Force

EVG

520IS Wafer Bonder

Fusion Compression Bonder, up to 6"/150mm Wafer Capable, 60kN Max Bond Force, 600C Max Temperature, Vintage 2008

FSI

Mercury Wet Process System

200mm wafers, Semi-Auto Batch Acid Spray system

MJB3 Mask Aligner (200W, IR)

Top and Backside IR Alignment, 200W Lamphouse, Mimir 505 Supply

5200XP Overlay Registration System

8"/200mm Wafer Capable, Fully Automated Non-Contact Box-In-Box Measurement

8"/200mm Wafers, Auto Focus, Double Darkfield Inspection

Up to 200mm, Four Point Probe, 3-D Plots, Contour Mapping

New Laser, New Power Supply, Calibrated to OEM Specifications, up to 8"/200mm Wafer Capable

New Laser, New Power Supply, Calibrated to OEM Specifications, up to 8"/200mm Wafer Capable

New Laser, New Power Supply, Calibrated to OEM Specifications, up to 8"/200mm Wafer Capable

New Laser, New Power Supply, Calibrated to OEM Specifications, up to 8"/200mm Wafer Capable

6-inch Polishing Jig

6" Vacuum Base, Dial Gauge

PM5 Lapping & Polishing System

Logitech PM5 Lapping & Polishing System

PP6 Polishing Jig

4" wafers, single dial gauge

Nanometrics

Film Thickness Measurement System, 200mm capable, Wafer Mapping Capability

OAI

2000 UV Flood Exposure System

6"/150mm Wafers, 1000W Lamphouse, Equipe Robot for Cassette Handling

Plasmalab 80 Plus RIE

Non-load locked RIE, 240mm electrode, Windows XP, 2005 vintage, like-new condition!

Plasmatherm

790 Dual Chamber PECVD

2 PECVD chambers, Twin 240mm Plates

Plasmatherm

790 PECVD System

PECVD Chamber, up to 150mm wafer capable, Non-Load Locked Chamber

Plasmatherm

8"/200mm wafers max, single load-locked chamber, 11" Electrode, Chlorine Chemistry

5ft Stainless Steel Wet Bench

Large stainless steel sink forparts cleaning or rinsing

Rucker & Kolls

260 Probe Station

4" vacuum chuck, B&L Stereozoom 4 Microscope

8" Wafer Capable, Dual Stack SRD, PSC-101 Controllers, Resistivity Monitors

LT-210C Cu Plating System

Cu Plating process

Sirius HydrOzone

200mm/300mm wafer sizes, Process: DI water/ozone

Spray Solvent Tool (SST)

8"/200mm capable, 4-Tanks, Spray Solvent Tool

Manual Probe Station

5" vacuum chuck, B&L Microzoom Microscope

STS

Pegasus ASE VPX Cluster Etcher

Deep Silicon Etching, 25um/min Etching Rate, setup for 200mm wafers

TMC

Vibration Isolation Table

47" X 30" x 31" H

TOHO

FLX-2320 Film Stress Measurement System

200mm Chuck, Temperature up to 500C, Data Analysis Capability

ST600 Megasonic System

Megasonic heated/chilled recirculating tank, sized for dual 6-inch cassettes!

ST600-42 Megasonic System

Megasonic heated/chilled recirculating tank, sized for dual 6-inch cassettes!

ST600-42 Megasonic System

1 Megasonic tank, sized for dual 6-inch cassettes!

Yield Engineering

YES LP3 HMDS Vapor Prime Oven

HMDS Vacuum Bake, Vapor Prime Oven, Vacuum Pump included