Wafer Inspection

Metrology Equipment

Wafer Inspection

Image

Manufacturer

Model

Configuration

Max Wafer

200mm Wafers, SECS II/GEM Interface, Refurbished to OEM Specifications

Macro Defect Inspection System

6"/150mm & 8"/200mm Wafers, Auto Focus, Double Darkfield Inspection

Patterned Surface Defect Inspection System, 8"/200mm Wafers

Patterned Surface Defect Inspection System, 8"/200mm Wafers, Dual Open Cassette

6"/150mm, 8"/200mm or 12"/300mm, Software Version 6.2, CE Marked

KLA-Tencor AIT XUV Darkfield Defect Inspection System

200mm wafers, Optical Defect Review System

200mm Open Cassette & 300mm FOUP Configuration

200mm/300mm, Puck/Vacuum, Open Handler, DIC Option

Unpatterned Wafer Surface Inspection Tool, Up to 8

200mm Wafers, New Laser, Optics Aligned, New Power Supply, Calibrated to OEM Specs

New Laser, New Power Supply, Calibrated to OEM Specifications, Up to 8"/200mm Wafer Capable

New Laser, New Power Supply, Calibrated to OEM Specifications, Up to 8"/200mm Wafer Capable

New Laser, New Power Supply, Calibrated to OEM Specifications, Up to 8"/200mm Wafer Capable