Mask Aligners

Process Equipment

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Mask Aligners

Mask Aligners

Browse our complete inventory below or click here to learn why you should choose ClassOne for high quality Mask Aligners equipment.

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Manufacturer

Model

Configuration

EVG

420 Mask Aligner

Top and Backside Alignment, 4" wafers, UV400 optics, 350W lamphouse

EVG

520 Wafer Bonder

Fusion & Thermal Compression Bonder, Up to 8"/200mm Wafer Capable, 7 kN Max Bond Force

EVG

520 Wafer Bonder

fusion compression bonder, up to 8"/200mm wafer capable, 3.5kN max bond force

EVG

520HE Hot Embossing System

200mm capable, designed for hot embossing and nanoimprinting applications, like-new condition!

EVG

620 Mask Aligner

Topside Alignment, 150mm wafer capable, Brand New PC, New Windows XP OS installed!

EVG

EV501 Wafer Bonder

100mm wafer bonder, 3.5kN contact pressure, configured for thermocompression, fusion, or anodic bonding

MA150cc Mask Aligner

Automatic Topside & Backside Alignment, 6"/150mm Wafers, Cassette to Cassette, 1000W Lamphouse, UV400 Optics

MA6 Mask Aligner

Topside & Backside Alignment, M306 Microscope, 350W Lamphouse, UV400 Optics

MA6 Mask Aligner

Topside Alignment, M306 Microscope, 350W Lamphouse, UV400 Optics

MA6 Mask Aligner

Topside & Backside Alignment, M306 Microscope, 1200W Lamphouse, UV400 Optics

MA6 Mask Aligner

Topside & Backside Alignment, DVM6 Microscope, 1000W Lamphouse, UV400 Optics

MA8 Mask Aligner

Topside Alignment, UV400 Optics, CIC1000 Power Supply, 1000W Lamphouse

MJB3 Mask Aligner (350W)

Topside Alignment, 350W lamphouse, Splitfield Microscope

MJB55 Mask Aligner

Topside Alignment, 350W lamphouse, up to 5" capable, Splitfield Microscope, Fully Refurbished

SB8e Substrate Bonder

Semi-Automatic Anodic Bonder, 8"/200mm, Computer-controlled

OAI

2000 Flood Exposure System

6"/150mm wafers, 500W Lamp, Equipe robot for cassette handling

OAI

2000 UV Flood Exposure System

6"/150mm Wafers, 1000W Lamphouse, Equipe Robot for Cassette Handling