Mask Aligners & Bonders

Process Equipment

Mask Aligners & Bonders

Image

Manufacturer

Model

Configuration

Max Wafer

EVG

520 Wafer Bonder

Fusion & Thermal Compression Bonder, 8"/200mm wafers, 7 kN Max Bond Force

EVG

520HE Hot Embossing System

Hot Embossing and Nano-Imprint system, 2007 vintage, Like-New Condition!

EVG

620 Mask Aligner

Topside Alignment, 150mm Wafers, Automatic Alignment, Like-New!

EVG

850 Production Bonder

8"/200 & 12"/300mm, SOI & Wafer Direct Bonding, 2007 Vintage, Like-New!

OAI

2000 Flood Exposure System

6"/150mm Wafers, 1000W Lamphouse, Equipe Robot for Cassette Handling

OAI

2000 Flood Exposure System

6"/150mm Wafers, 500W Lamp, Equipe Robot for Cassette Handling

Suss

MA150cc Mask Aligner

Automatic Topside Alignment, 6"/150mm Wafers, Cassette to Cassette, 1000W Lamphouse, UV400 Optics

Suss

MA6/BA6 Mask Aligner

Topside Alignment, 350W Lamphouse, UV400 Optics

Suss

MA8/BA6 Mask Aligner

Topside and Backside (BSA) Alignment, 8"/200mm Wafers, 1000W Lamphouse

Suss

MJB3 Mask Aligner (200W)

Topside Alignment, 200W Lamphouse, Power Supply, UV400 Optics

Suss

MJB3 Mask Aligner (350W)

Topside Alignment, 350W Lamphouse, Splitfield Microscope

Suss

SB8e Wafer Bonder

Semi-Automatic Anodic Bonder, 8"/200mm, Computer-Controlled