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Max Wafer
EVG
520 Wafer Bonder
Fusion & Thermal Compression Bonder, 8"/200mm wafers, 7 kN Max Bond Force
200mm
EVG
520HE Hot Embossing System
Hot Embossing and Nano-Imprint system, 2007 vintage, Like-New Condition!
200mm
EVG
620 Mask Aligner
Topside Alignment, 150mm Wafers, Automatic Alignment, Like-New!
150mm
EVG
850 Production Bonder
8"/200 & 12"/300mm, SOI & Wafer Direct Bonding, 2007 Vintage, Like-New!
300mm
EVG
EV CS50 Wafer Cooler
EVG EV CS50 Wafer Cooler
150mm
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ClassOne Equipment, Inc. 5302 Snapfinger Woods Drive, Decatur, Georgia 30035, United States
Tel: +1 770 808 8708, Fax: +1 770 808 8308, Email:
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