EVG 510 Wafer Bonder
OEM Part #:
OEM Name:
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Product Details:
EVG 510 Wafer Bonder consisting of:
- Model: 510 Wafer Bonder - Manual wafer load substrate bonder - Capable of fusion compression bonding - Capable of thermal compression bonding - Ideal for R&D and pilot production applications - High-vacuum capable bond chamber - Windows based control software and operation interface - Wafer size: up to 8”/200mm capable - Max Bond Force: 10 kN - Top side heater: 550°C max. in 1°C steps - Bottom side heater: 550°C max. in 1°C steps - Temperature uniformity: ± 1,5 %Turbo pump and controller - Roughing pump - System Chiller - Load/unload tool - System computer, monitor, and keyboard - PDF Operations Manual for EVG 510 Bonder - Manufactured in 2019
Condition:
Condition:
Excellent Condition Guaranteed.
Fully Refurbished to Factory Specifications by ClassOne.
6 Month Warranty and Full Specifications Guarantee.
30 Day Right of Return.
As-Is / Where-Is Pricing is Also Available!
Description:
EVG 510 Wafer Bonder.
