Toho FLX-2320-S Film Stress Measurement System
OEM Part #:
FLX-2320
OEM Name:
Toho
ID #:
4715
Product Details:
TOHO FLX-2320-S FILM STRESS MEASUREMENT SYSTEM consisting of:
- Model: FLX-2320-S - Manual Wafer Load - Thin Film Stress Measurement System - Chuck Size: 8"/200mm - Temperature: up to 500C - Dual Wavelength Technology - Microsoft Windows based software - 2.8 GHz Pentium Computer - Brand New Monitor - Wafer Locator Included (1 set, select size at time of order) - Gas Inlet for Inert Gas Atmosphere Stress Measurement - Vintage 2011 - System Power: 230V, 50/60Hz, 1PH, 30A - Operations Manual and Documentation - Refurbished to Meet OEM Specifications
TOHO FLX-2320 System Capabilities consisting of:
- Thin-film stress measurement instrument that measures the changes in the radius of curvature of a wafer caused by the deposition of a stressed thin film. - Laser scanning to measure stress on all reflecting films. - Measures and displays stress as a function of time or temperature. - Comprehensive data analysis capabilities that include trend plotting for statistical process control (SPC) and displaying a 3-D map of wafer deflection over the entire surface. - Used for calculation of biaxial modulus of elasticity and linear expansion, water diffusion coefficient in dielectric films, linear regression and stress-temp or stress-time gradients. - Provides analysis of thin film stress with very low measurement noise and allows observation and quantitative evaluation of stress relaxation, oxide densification, thin film phase transformations and annealing.
- Model: FLX-2320-S - Manual Wafer Load - Thin Film Stress Measurement System - Chuck Size: 8"/200mm - Temperature: up to 500C - Dual Wavelength Technology - Microsoft Windows based software - 2.8 GHz Pentium Computer - Brand New Monitor - Wafer Locator Included (1 set, select size at time of order) - Gas Inlet for Inert Gas Atmosphere Stress Measurement - Vintage 2011 - System Power: 230V, 50/60Hz, 1PH, 30A - Operations Manual and Documentation - Refurbished to Meet OEM Specifications
TOHO FLX-2320 System Capabilities consisting of:
- Thin-film stress measurement instrument that measures the changes in the radius of curvature of a wafer caused by the deposition of a stressed thin film. - Laser scanning to measure stress on all reflecting films. - Measures and displays stress as a function of time or temperature. - Comprehensive data analysis capabilities that include trend plotting for statistical process control (SPC) and displaying a 3-D map of wafer deflection over the entire surface. - Used for calculation of biaxial modulus of elasticity and linear expansion, water diffusion coefficient in dielectric films, linear regression and stress-temp or stress-time gradients. - Provides analysis of thin film stress with very low measurement noise and allows observation and quantitative evaluation of stress relaxation, oxide densification, thin film phase transformations and annealing.
Condition:
Excellent Condition Guaranteed.
Fully Refurbished to Excellent Condition by ClassOne.
6 Month Warranty.
30 Day Right of Return.
Fully Refurbished to Excellent Condition by ClassOne.
6 Month Warranty.
30 Day Right of Return.
Description:
Toho FLX-2320-S Stress Measurement System.
