Solstice Single-Wafer
Surface Preparation Tools

Advanced surface preparation solutions

for optimized wafer uniformity and process control

The high-performance Solstice® automated single-wafer platform offers a suite of surface preparation technologies and features a face-down wafer processing scheme. This architecture allows for direct chemistry impingement on the wafer surface, which enhances the speed and uniformity of etch, strip, and MLO processes. It also gives Solstice a huge safety advantage compared to the commonly-employed face-up architectures, as the fully sealed chambers efficiently drain and exhaust dangerous chemistries. The platform also easily integrates technology for temperature and concentration bath control, enabling consistent wafer processing and extended bath life.

In addition, the optional white-light End Point Detection (EPD) feature provides efficient processing for film-removal etch, such as under-bump metallization (UBM) etch or seed etch. The FaceUp spin rinse dry (SRD) module mounts above the process chambers and provides fast, clean dries because of its chemically segregated location at the top of the tool. In safety, performance, and reliability, Solstice brings an exceptional array of surface preparation capabilities.

Solstice Wet Etch processing

• High performance, superior CoO, improved safety
• Face-down processing, end-point detection, face-up SRD
• Key processes: UBM etch, patterned metal etch, KOH etch, TSV cleans, RCA cleans

Solstice MLO and Photoresist Strip processing

• High-performance single-wafer automated solvent
• Effective strip and removal without wet transfers
• Key processes: MLO, photoresist strip, polymer removal