Equipment

Showing 1–12 of 190 results

Takano Altax 300ex Micro Bump Whole Surface Inspection System
5039

Manufacturer:

Takano

Model:

Altax 300ex

Max Wafer:

300mm

ID #:

5039

Configuration:

Unparalleled inspection speed contributes to increased production capacity!

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Takano Vi-5301 M Patterned Wafer Visual Inspection System
5038

Manufacturer:

Takano

Model:

Vi-5301 M

Max Wafer:

300mm

ID #:

5038

Configuration:

Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate

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Takano Vi-4307 M/C Patterned Wafer Visual Inspection System
5037

Manufacturer:

Takano

Model:

Vi-4307 M/C

Max Wafer:

300mm

ID #:

5037

Configuration:

Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate

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Takano Vi-4207 R/C Patterned Wafer Visual Inspection System
5036

Manufacturer:

Takano

Model:

Vi-4207 R/C

Max Wafer:

200mm

ID #:

5036

Configuration:

Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate

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EVG 501 Wafer Bonder
5034

Manufacturer:

EVG

Model:

EVG501 Wafer Bonder

Max Wafer:

ID #:

5034

Configuration:

150mm wafer bonder, configured for thermocompression, fusion, or silicon direct wafer bonding

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EVG 620 Mask Aligner (Upgraded from a 420)
5033

Manufacturer:

EVG

Model:

620 Mask Aligner (Upgraded from a 420)

Max Wafer:

150mm

ID #:

5033

Configuration:

6"/150mm, Top & Backside Side Alignment, 500W Lamphouse

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Yield Engineering YES-15F HMDS Oven
5032

Manufacturer:

Yield Engineering

Model:

YES-15F HMDS Oven

Max Wafer:

ID #:

5032

Configuration:

HMDS Vapor Prime Oven, Dual Function (Prime / Reversal), Up to 200 Degrees Celsius, Chamber Dimensions 16” x 16” x 16”, 8 Heaters (200 Watt Each)

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Brewer Science / CEE 200 Spin Coater
5031

Manufacturer:

CEE

Model:

200

Max Wafer:

200mm

ID #:

5031

Configuration:

CEE 200 Coater

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Brewer Science / CEE 200 Spin Coater
5030

Manufacturer:

CEE

Model:

200

Max Wafer:

200mm

ID #:

5030

Configuration:

CEE 200 Coater

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KLA-Tencor Alpha-Step IQ Profiler
5029

Manufacturer:

KLA-Tencor

Model:

Alpha-Step IQ Profiler

Max Wafer:

150mm

ID #:

5029

Configuration:

6"/150mm Wafer Capable, Measurement Resolution to 1 Angstrom

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Suss 350W MJB3 Mask Aligner – SN:
5028

Manufacturer:

Suss

Model:

MJB3 Mask Aligner (350W)

Max Wafer:

75mm

ID #:

5028

Configuration:

Topside Alignment, 350W Lamphouse, Splitfield Microscope

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OAI MBA 806 Mask Aligner
5026

Manufacturer:

OAI

Model:

MBA 806

Max Wafer:

150mm

ID #:

5026

Configuration:

Topside & Backside Alignment, up to 6"/150mm wafer capable, 350W NUV lamphouse, Low-cost R&D mask aligner

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