• Home
  • -
  • EVG Gemini Automated Production Wafer Bonding System

EVG Gemini Automated Production Wafer Bonding System

OEM Part #:

Gemini Wafer Bonder

OEM Name:

EVG

ID #:

4431

Product Details:

EVG GEMINI AUTOMATED PRODUCTION WAFER BONDING SYSTEM consisting of:

-    Fully automated operation
-    Interlocked doors with signal light tower
-    4 Axis Industrial Robot
-    EVG CIM Framework Software GUI (Graphical User Interface)
-    Flexible process flow definition
-    Drag and drop recipe programming
-    Parallel processing of multiple jobs
-    Automated recording of process and machine parameters
-    Throughput optimized handling sequence
-    Password protected user access levels
-    Open cassette loading with empty/present sensor
-    Currently configured for 6" (150mm) wafers (4" and 8" optional with additional hardware)
-    Qty 8 bond chucks included for 6" wafers, additional chucks can be offered
-    SmartView®NT Alignment Module with 5x Objectives
-    4 Bond modules with up to 550°C and 10kN bond force
-    Formic Acid Bubbler option for purging formic acid vapor into bond chamber
-    1 purge gas line for process gas
-    CE Certified
-    System documentation
-    Vintage 2015

Condition:

Used

Condition:

Operational in fab.  System is being sold as-is.

Description:

EVG Gemini Automated Production Wafer Bonding System

Additional Questions: