Solstice Single-Wafer
Electroplating Tools
Customizable, modular, and scalable –
automated single-wafer processing with maximum ROI
The Solstice® automated single-wafer platform offers advanced electroplating technologies, from gold and copper to nickel and indium, on a single, flexible and compact system. Elegantly designed from the ground up, Solstice continues to be one the most flexible wet-processing platforms available. It enables solutions with up to 8 chambers for multiple plating, solvent and wet etch applications, suitable for both R&D and high-volume manufacturing environments.
Available with up to 3, 4 or 8 chambers
The unique Solstice platform can accommodate a variety of substrate types, from traditional silicon devices to compound semiconductors and emerging materials such as glass. The systems can process wafers down to 75mm in diameter — whether mounted, thinned, flatted, bowed, or transparent — and can handle multiple wafer sizes on a single system. Wafer rotor changes take less than 5 minutes, maximizing system uptime and contributing to the platform’s ease of operation and maintenance.
Multiple processes on a single platform
Solstice's uniquely modular design gives it exceptional flexibility. You can custom-configure and optimize the system you need by mixing and matching processing chambers and technologies across both electroplating and surface prep to meet your specific process requirements. For example, it can perform both electroplating and metal lift-off on the same system. Solstice lets you create system configurations that are optimized for specific processes and also for higher-volume manufacturing.
Solstice GoldPro
- World-class uniformity and speed for: fine feature gold fill, gold TWV, through mask gold plating
- Learn more: GoldPro datasheet
Solstice CopperMax
- Cationic membrane-based copper plating for: copper pillar, copper TSV and TWV, copper RDL, copper damascene
- Learn more: CopperMax datasheet
Solstice Packaging
- Metal stacks for AP techniques: Nickel plating, copper pillar, solder bump, alloys and more
- Learn more: Solstice Packaging datasheet
Solstice Wet Etch
- High performance, better CoO, improved safety
- Face-down processing, end-point detection, face-up SRD
- Key processes: UBM etch, patterned metal etch, KOH etch, TSV cleans, RCA cleans
- Learn more: Solstice Wet Etch datasheet
Solstice MLO and Photoresist Strip
- High-performance single-wafer automated solvent
- Effective strip and removal without wet transfers
- Key processes: MLO, photoresist strip, polymer removal
- Learn more: Solstice MLO & PR Strip datasheet
