KLA-Tencor FLX-2320 Film Stress Measurement System

KLA-TENCOR FLX-2320 FILM STRESS MEASUREMENT SYSTEM consisting of:

- Model: FLX-2320I
- Manual Wafer Load
- Thin Film Stress Measurement System
- Chuck Size can be configured for up to 8“ wafers
- Temperature: up to 500C
- Dual Wavelength Technology
- Operating System: MS-DOS V6.22
- Software Version 2.0
- Operations Manual and Documentation
- 6 Month Warranty

KLA-TENCOR FLX-2320 SYSTEM CAPABILITIES consisting of:

- Thin-film stress measurement instrument that measures the changes in the
radius of curvature of a wafer caused by the deposition of a stressed thin film.
- Laser scanning to measure stress on all reflecting films.
- Measures and displays stress as a function of time or temperature.
- Comprehensive data analysis capabilities that include trend plotting for
statistical process control (SPC) and displaying a 3-D map of wafer deflection
over the entire surface.
- Used for calculation of biaxial modulus of elasticity and linear expansion,
water diffusion coefficient in dielectric films, linear regression and stress-temp
or stress-time gradients.
- Provides analysis of thin film stress with very low measurement noise and
allows observation and quantitative evaluation of stress relaxation, oxide
densification, thin film phase transformations and annealing.

- NOTE: This system requires the use of reflective substrates to run the pre/post deposition measurements, transparent substrates will not work. In most cases customers use Si monitor wafers for stress measurement instead of product wafers.

KLA-TENCOR REFURBISHMENT PROCESS consists of:

- Replace used Laser with New Laser.
- Replace used Photomultiplier Tubes (PMTs) with Brand New PMTs, as
required.
- Replace used Power Supply, as required.
- Replacement or repair of any bad circuit board.
- Mechanical assemblies cleaned, lubricated, rebuilt, or replaced as needed.
- Optics assemblies cleaned and aligned to meet performance specifications
or replaced as needed.
- Electronic assemblies tested to meet performance specifications or replaced
as needed.
- Puck assembly rebuilt or replaced (if applicable).
- Replace old monitor with Brand New LCD Monitor.
- Calibrate system using calibration wafers.
- Machine covers are cleaned, polished, or replaced, as needed.
- Machine is fully tested.
- System de-installed following proper procedures.
- System transport locks installed; system prepared for shipment.
- Refurbishment carried out by KLA-Tencor trained technicians.