KLA-Tencor FLX-2320 Film Stress Measurement System

KLA-TENCOR FLX-2320 FILM STRESS MEASUREMENT SYSTEM consisting of:

- Model: FLX-2320 - Manual Wafer Load - Thin Film Stress Measurement System - Chuck Size can be configured for up to 8“ wafers - Temperature: up to 500C - Dual Wavelength Technology - Operating System: MS-DOS V6.22 - Software Version 2.0 - Operations Manual and Documentation - 6 Month Warranty

KLA-TENCOR FLX-2320 SYSTEM CAPABILITIES consisting of:
- Thin-film stress measurement instrument that measures the changes in the radius of curvature of a wafer caused by the deposition of a stressed thin film. - Laser scanning to measure stress on all reflecting films. - Measures and displays stress as a function of time or temperature. - Comprehensive data analysis capabilities that include trend plotting for statistical process control (SPC) and displaying a 3-D map of wafer deflection over the entire surface. - Used for calculation of biaxial modulus of elasticity and linear expansion, water diffusion coefficient in dielectric films, linear regression and stress-temp or stress-time gradients. - Provides analysis of thin film stress with very low measurement noise and allows observation and quantitative evaluation of stress relaxation, oxide densification, thin film phase transformations and annealing.
- NOTE: This system requires the use of reflective substrates to run the pre/post deposition measurements, transparent substrates will not work. In most cases customers use Si monitor wafers for stress measurement instead of product wafers.

KLA-TENCOR REFURBISHMENT PROCESS consists of:

- Replace used Laser with New Laser. - Replace used Photomultiplier Tubes (PMTs) with Brand New PMTs, as required. - Replace used Power Supply, as required. - Replacement or repair of any bad circuit board. - Mechanical assemblies cleaned, lubricated, rebuilt, or replaced as needed. - Optics assemblies cleaned and aligned to meet performance specifications or replaced as needed. - Electronic assemblies tested to meet performance specifications or replaced as needed. - Puck assembly rebuilt or replaced (if applicable). - Replace old monitor with Brand New LCD Monitor. - Calibrate system using calibration wafers. - Machine covers are cleaned, polished, or replaced, as needed. - Machine is fully tested. - System de-installed following proper procedures. - System transport locks installed; system prepared for shipment. - Refurbishment carried out by KLA-Tencor trained technicians.