Oxford Plasmalab 80 Plus RIE System

OXFORD PLASMALAB 80 PLUS RIE ETCHER consisting of:
- Model: Plasmalab 80 Plus RIE - Single Chamber RIE, non-load locked - Ideal for R&D reactive ion etch application - Process: Dielectric etch and Descum - System setup with universal platen (with ability to place various size(s) of substrates). - Up to 200mm wafer capable - System PC, Keyboard, Mouse - 300W RF Generator 13.56MHz - Turbo Pump - Rotary Vane Rough Pump, Fomblin Prep - Chiller - 415Vac, 3ph, 32A - Operations Manual and Documentation - Fully Refurbished to excellent condition (see below details)

Gas Box Currently Configured for: Ar, CF4, O2, CHF3, SF6 & He - System components carefully packed, labeled, and professionally crated.

OXFORD REFURBISHMENT PROCESS consists of: - Chamber disassembled for refurbishment. - Chamber received full wet clean. - Chamber o-rings and seals are replaced with brand new. - Electrostatic Chuck (ESC) sent out for refurbishment (if applicable) - All MFCs rebuilt and calibrated professionally. - All corrosive gas lines replaced with brand new. - All Non-corrosive gas lines purged. - Vacuum pumps professionally rebuilt. - Turbo pump professionally rebuilt. - Chillers serviced and fully tested. - All wiring/wire harnesses are checked, repaired or replaced if needed. - All liquid and air lines, tubing and fittings checked and replaced if necessary. - Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed. - Checkout of all electronic and mechanical parts. - Machine covers are cleaned, polished or replaced as needed. - Post-refurbishment system leak and RF calibration checks, with documentation provided to customer. - System cycle and repeatability testing completed prior to cover replacement and wipe down. - System components carefully packed, labeled, and professionally crated.