Rudolph / August NSX-105 Automated Wafer, Die & Bump Inspection
OEM Part #:
NSX-105
OEM Name:
Rudolph / August
ID #:
4767
Product Details:
Rudolph / August NSX-105 Automated Wafer, Die & Bump Inspection consisting of:
- Model: NSX-105
- Automated Wafer, Die & Bump Inspection
- 4”/6”/8” Wafer Handler
- Ultraport top plate
- Objectives: 1, 2, 5, 20x
- PC
- Worm screw for Y
- Linear for X
- NSK controller for theta
- Laser focus sensor
- Toshiba for color review
- Adimec inspection camera
- 1 genesis main board
- 3 Genesis Node board
- SN: NSX1407
Condition:
Used
Condition:
As-Is / Where-Is Condition.
Description:
Rudolph / August NSX-105 Automated Wafer, Die & Bump Inspection
Additional Questions:
Contact: sales@classoneequipment.com
