SUSS SB8e SUBSTRATE BONDER
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Product Details:
SUSS SB8e SUBSTRATE BONDER consisting of:
- Model: SB8e - Manual Wafer Load Wafer Bonder - One set of Tooling provided for up to 200mm wafers - Piston Force: 20kN Max. - Vacuum down to 5x10e-5 mbar. - Overpressure control with 3 bar max - Bonding in controlled environment - Flexible process control using a Windows operating environment with data recording and analysis - Bond Types capable: Silicon Fusion, Adhesive, Thermal Compression. - Anodic capability can be added at additional cost - Temperature Control to 500 degrees C - Top and Bottom Heaters - Vacuum Pump - Turbo Pump - Operating Manual
Condition:
Condition:
Excellent Condition Guaranteed.
Fully Refurbished to Factory Specifications by ClassOne.
6 Month Warranty and Full Specifications Guarantee.
30 Day Right of Return.
As-Is / Where-Is Pricing is Also Available.
Description:
Suss SB8e Substrate Bonder.
