Used SUSS Mask Aligners: Are They Still Worth It for Lab Applications?

If you run a university cleanroom, a startup R&D lab, or a pilot line, your mask aligner has to “just work.” You need repeatable sub-micron results, quick changeovers from small pieces to 150 mm wafers, and exposure flexibility from proximity to vacuum contact—often with backside alignment for MEMS or through-wafer features. New platforms do this well, but so do used, properly refurbished SUSS systems when they’re backed by the right process, parts, and support—start with our Refurbished SUSS & EVG overview.

What labs actually need from a mask aligner

Alignment accuracy and resolution. Most academic and R&D environments target sub-micron features and tight overlay—ambitious, but squarely in the wheelhouse of the SUSS MA6/BA6 when it’s refurbished and calibrated correctly.

Mode flexibility. Labs move from soft to hard or vacuum contact and then proximity in a single day. MA6/BA6 supports these modes, while the broader Mask Aligners & Bonders catalog covers everything from manual MJB-series training tools to automated 200 mm options.

Backside alignment (BSA). Many refurbished MA6/BA6 include BSA; capability expands with parts like a 6-inch BSA auto-load chuck (KS1499).

Throughput for lab use. Teaching labs and research groups value predictable setups. MA6/BA6 balances throughput and versatility, while the SUSS MA200e scales to 200 mm automation.

A quick refresher on SUSS models you’ll see in labs

• MA6 / BA6 (6-inch) — Classic university workhorse, sub-micron contact, BSA options. See current MA6/BA6 listing.
• MA8 / BA8 (8-inch) — Similar DNA with larger format, see catalog.
• MA200 / MA200e (200 mm) — Higher automation and throughput. See MA200e.
• MJB-series (manual/teaching) — Entry-level training tool. See SUSS MJB3 350 W.

Where used SUSS aligners still excel in the lab

1. Resolution & overlay — MA6/BA6 delivers 0.5–2 µm features reliably.
2. Exposure modes — Soft/hard/vacuum contact and proximity all supported.
3. Broad substrate support — From 1″ pieces up to 150 mm wafers.
4. Backside alignment — With BSA optics and chucks (KS1499, KS1199).
5. Lower TCO — Refurbished aligners reduce costs while maintaining quality.

When to favor a newer platform (or a different brand)

• Standardizing on 200 mm — Step up to MA200e.
• Heavier automation or bond alignment — Compare with EVG 620.
• Specialty processes — Browse Mask Aligners & Bonders catalog.

What to evaluate when buying used (checklist)

• Optics & lamp house — Check wavelength filters, lamp intensity, mirrors, and uniformity.
• Alignment systems — Verify topside & BSA accuracy, microscope optics, cameras.
• Contact & chucking — Ensure all modes work; verify chucks and maskholders (KS1211, KS1221, KS1212).
• Mechanics & pneumatics — Review WEC head rebuilds, regulators, stage accuracy.
• Documentation & training — Require installation, warranty, and spares; see Refurbished SUSS & EVG.

Real-world lab scenarios

• Microfluidics — Sub-micron alignment, reliable contact modes, natural fit for teaching labs.
• MEMS & through-wafer alignment — Use BSA chucks (KS1499, KS1199).
• General prototyping — Flexible g-/i-line resist support and proximity mode.
• Training & teaching — SUSS MJB3 offers accessible controls for coursework.

Bottom line

A quality-refurbished SUSS MA6/BA6 checks the boxes: sub-micron capability, BSA, flexible exposure modes, broad substrate support, and lower TCO. When your work shifts toward 200 mm automation, step up to the MA200e or compare with EVG 620.